TY - GEN
T1 - Characterization of a Flexible Polymer-Based Substrate Material for RF Applications
AU - Michler, Fabian
AU - Kolpak, Jasmin
AU - Scheiner, Benedict
AU - Weigel, Robert
AU - Hagelauer, Amelie
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - While mechanically flexible substrate materials are widely used in electronics, especially for interconnects between moving system parts or medical sensors to be mounted onto the body surface, they are barely used in micro- and millimeter-wave applications. In this work, the design permittivity of a low-cost, polymer-based flexible substrate is extracted by measurement and the insertion losses of typical line structures are measured. Moreover, application examples of a patch antenna and a bendable substrate-integrated waveguide are presented.
AB - While mechanically flexible substrate materials are widely used in electronics, especially for interconnects between moving system parts or medical sensors to be mounted onto the body surface, they are barely used in micro- and millimeter-wave applications. In this work, the design permittivity of a low-cost, polymer-based flexible substrate is extracted by measurement and the insertion losses of typical line structures are measured. Moreover, application examples of a patch antenna and a bendable substrate-integrated waveguide are presented.
KW - flexible electronics
KW - material characterization
KW - microwave measurements
KW - permittivity
KW - printed circuit boards
UR - http://www.scopus.com/inward/record.url?scp=85149340860&partnerID=8YFLogxK
U2 - 10.1109/RWS55624.2023.10046309
DO - 10.1109/RWS55624.2023.10046309
M3 - Conference contribution
AN - SCOPUS:85149340860
T3 - IEEE Radio and Wireless Symposium, RWS
SP - 27
EP - 30
BT - 2023 IEEE Radio and Wireless Symposium, RWS 2023
PB - IEEE Computer Society
T2 - 2023 IEEE Radio and Wireless Symposium, RWS 2023
Y2 - 22 January 2023 through 25 January 2023
ER -