Characterization and simulation of silicon power devices up to very high temperatures

P. Borthen, G. Wachutka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

We investigated and calibrated physically-based high-temperature device models on the basis of measurements and simulations of industrial power MOSFETs and Non-Punch Through (NPT) 600V IGBTs (both from Infineon AG) in a temperature range from room temperature up to 750 K.

Original languageEnglish
Title of host publicationProceedings of the International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2006
Pages612-614
Number of pages3
StatePublished - 2006
EventInternational Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2006 - Gdynia, Poland
Duration: 22 Jun 200624 Jun 2006

Publication series

NameProceedings of the International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2006

Conference

ConferenceInternational Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2006
Country/TerritoryPoland
CityGdynia
Period22/06/0624/06/06

Keywords

  • High-temperature device models
  • High-temperature electrical measurements and model calibration

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