Carbon nanotubes in interconnect applications

F. Kreupl, A. P. Graham, G. S. Duesberg, W. Steinhögl, M. Liebau, E. Unger, W. Hönlein

Research output: Contribution to journalConference articlepeer-review

514 Scopus citations

Abstract

Carbon nanotubes with their outstanding electrical and mechanical properties are suggested as an interconnect material of the future. In this paper we will introduce nanotubes, compare their electrical properties with equivalent metal wires made of gold and describe our progress in process integration. Multi-walled carbon nanotubes are grown on 6-inch wafers in a batch process. The resulting nanotubes are evaluated with respect to their conductance as single multiwalled nanotubes and in their implementation as interconnects in vias and contact holes.

Original languageEnglish
Pages (from-to)399-408
Number of pages10
JournalMicroelectronic Engineering
Volume64
Issue number1-4
DOIs
StatePublished - Oct 2002
Externally publishedYes
EventMAM2002 - Vaals, Netherlands
Duration: 3 Mar 20026 Mar 2002

Keywords

  • Carbon nanotube
  • Current density
  • Interconnects
  • Nano-wire

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