TY - GEN
T1 - Bitline-capacitance-cancelation sensing scheme with 11ns read latency and maximum read throughput of 2.9GB/s in 65nm embedded flash for automotive
AU - Jefremow, Mihail
AU - Kern, Thomas
AU - Backhausen, Ulrich
AU - Peters, Christian
AU - Parzinger, Christoph
AU - Roll, Christoph
AU - Kassenetter, Stephan
AU - Thierold, Stefanie
AU - Schmitt-Landsiedel, Doris
PY - 2012
Y1 - 2012
N2 - The markets trends in the automotive industry of efficiency, safety and standardization, demand an increase in system performance (e.g., system frequency or by using multi core architectures) in microcontrollers for automotive powertrain applications. Since embedded nonvolatile memory is an essential part of such an SoC, the memory read speed must increase at the same rate to achieve best possible overall system performance. A further trend is that memory size is increasing with every new technology node to support complex algorithms required for real-time automotive applications. Larger memory sizes lead typically to an increase of the bitline (BL) capacitance, which is one of the most critical parameters for read performance of a memory array.
AB - The markets trends in the automotive industry of efficiency, safety and standardization, demand an increase in system performance (e.g., system frequency or by using multi core architectures) in microcontrollers for automotive powertrain applications. Since embedded nonvolatile memory is an essential part of such an SoC, the memory read speed must increase at the same rate to achieve best possible overall system performance. A further trend is that memory size is increasing with every new technology node to support complex algorithms required for real-time automotive applications. Larger memory sizes lead typically to an increase of the bitline (BL) capacitance, which is one of the most critical parameters for read performance of a memory array.
UR - http://www.scopus.com/inward/record.url?scp=84860667742&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2012.6177076
DO - 10.1109/ISSCC.2012.6177076
M3 - Conference contribution
AN - SCOPUS:84860667742
SN - 9781467303736
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 428
EP - 429
BT - 2012 IEEE International Solid-State Circuits Conference, ISSCC 2012 - Digest of Technical Papers
T2 - 59th International Solid-State Circuits Conference, ISSCC 2012
Y2 - 19 February 2012 through 23 February 2012
ER -