Abstract
The metallographic reactions between tin solder and copper matrix are analyzed on the basis of literature data and the authors' own investigations. Reactions during soldering (melting, diffusion, compound formation) and during service involving exposure to alternating thermal stresses are considered. About 20 scanning electron micrographs illustrate the text.
| Translated title of the contribution | Formation of Intermetallic Phases in Soldered Joints and the Effect of these Phases on Fracture Behavior. |
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| Original language | German |
| Pages (from-to) | 258-262 |
| Number of pages | 5 |
| Journal | Welding and Cutting |
| Volume | 29 |
| Issue number | 7 |
| State | Published - 1977 |