Benchmarking IWO-based Logic Circuits for Monolithic 3D Integration

Sufia Shahin, Shubham Kumar, Swetaki Chatterjee, Hussam Amrouch, Yogesh Singh Chauhan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This study shows a comprehensive evaluation of Back End Of Line (BEOL) compatible Tungsten doped amorphous Indium Oxide (a-IWO) Dual-Gate (DG) Thin Film Transistor (TFT) showcasing high performance at an ultra-thin channel thickness of 7 nm with on-off current ratio ∼ 4× 109. In this study, digital logic gates such as the inverter, NAND, and NOR gates were tested against 28 nm FDSOI CMOS technology. The results showed that the TFT technology outperformed the FDSOI technology in terms of static and dynamic power consumption, as well as energy efficiency. The improvements reported by TFT were quite significant. For the NAND logic implementations, the performance improved by factors of 1.53×, 10.3×, and 6.4×, respectively. However, for the NOR logic implementation, the performance improvement factors were 0.33×, 14.8×, and 8.8×, respectively.

Original languageEnglish
Title of host publicationIEEE Electron Devices Technology and Manufacturing Conference
Subtitle of host publicationStrengthening the Globalization in Semiconductors, EDTM 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350371529
DOIs
StatePublished - 2024
Event8th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2024 - Bangalore, India
Duration: 3 Mar 20246 Mar 2024

Publication series

NameIEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024

Conference

Conference8th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2024
Country/TerritoryIndia
CityBangalore
Period3/03/246/03/24

Keywords

  • Amorphous Indium Tungsten Oxide (a-IWO)
  • Back End Of Line (BEOL)
  • Dual-Gate Thin Film Transistor (DG-TFT)
  • FDSOI

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