TY - GEN
T1 - AUTOMATED DESIGN OF CUSTOM PRINTED CIRCUIT BOARD ENCLOSURES WITH INTEGRATED COOLING CAPABILITIES
AU - Pancheri, Felix
AU - Sun, Yilun
AU - Parhofer, Christoph A.W.
AU - Rehekampff, Christoph
AU - Zhang, Dingzhi
AU - Lueth, Tim C.
N1 - Publisher Copyright:
Copyright © 2023 by ASME.
PY - 2023
Y1 - 2023
N2 - Power electronics or processing units generate significant amounts of heat during operation, which must be dissipated. At the same time, there is a trend towards the production of small quantities of individual printed circuit boards. Thus, more and more individual cooling solutions for printed circuit boards are required. Conventionally, individual components on printed circuit boards are cooled using commercially available heat sinks. Housing the printed circuit board inside an enclosure can affect the cooling performance of heat sinks. If a printed circuit board is unusually shaped or a particularly compact design is required, suitable prefabricated enclosures are not necessarily available. In these situations, enclosures designed specifically for an individual printed board can be used. Custom designed enclosures made of materials with sufficiently high thermal conductivity can serve directly as heat sinks. In this work, an automated design process of custom dual-purpose enclosures for printed circuit boards with integrated cooling capabilities is proposed. The automated design process is based on the Solid-Geometry (SG) Library, a MATLAB-toolbox for automated design of surface models and optimized for additive manufacturing methods. Based on a geometry model of the printed circuit board, a suitable enclosure is automatically designed. In addition, several design examples are also presented to demonstrate the feasibility of the proposed approach.
AB - Power electronics or processing units generate significant amounts of heat during operation, which must be dissipated. At the same time, there is a trend towards the production of small quantities of individual printed circuit boards. Thus, more and more individual cooling solutions for printed circuit boards are required. Conventionally, individual components on printed circuit boards are cooled using commercially available heat sinks. Housing the printed circuit board inside an enclosure can affect the cooling performance of heat sinks. If a printed circuit board is unusually shaped or a particularly compact design is required, suitable prefabricated enclosures are not necessarily available. In these situations, enclosures designed specifically for an individual printed board can be used. Custom designed enclosures made of materials with sufficiently high thermal conductivity can serve directly as heat sinks. In this work, an automated design process of custom dual-purpose enclosures for printed circuit boards with integrated cooling capabilities is proposed. The automated design process is based on the Solid-Geometry (SG) Library, a MATLAB-toolbox for automated design of surface models and optimized for additive manufacturing methods. Based on a geometry model of the printed circuit board, a suitable enclosure is automatically designed. In addition, several design examples are also presented to demonstrate the feasibility of the proposed approach.
UR - http://www.scopus.com/inward/record.url?scp=85185394581&partnerID=8YFLogxK
U2 - 10.1115/IMECE2023-113510
DO - 10.1115/IMECE2023-113510
M3 - Conference contribution
AN - SCOPUS:85185394581
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Advanced Materials
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2023 International Mechanical Engineering Congress and Exposition, IMECE 2023
Y2 - 29 October 2023 through 2 November 2023
ER -