Auflösungskinetik verschiedener Metallisierungen für Leiterplatten in Abhängigkeit von den verwendeten

The field of application for electronic assemblies expands continuously. Especially in automotive and telecommunication systems the use of electronic assemblies increases. At the same time the increasing numbers of electronic functions and the decreasing of the pin distance leads to smaller and smaller dimensions under extreme environmental conditions - especially variations in temperature and humidity. By using electrochemical analysis methods such as free corrosion potential and current-density potential curves which until today have only been used sporadically as test procedures in electronics and, if at all, only in relation to the final result of individual measurements, it is in fact possible to estimate reliability already in advance. This enable us to assess new material/flux combinations in a selection procedure, and thus to further reduce development times and costs. This is of particular importance in view of the prohibition of lead-containing soldering materials, since there are hardly any findings about the proneness of substitute combinations to subsequent migration and corrosion.