Approaches for additive manufacturing of 3D electronic applications

J. Hoerber; J. Glasschroeder; M. Pfeffer; J. Schilp; M. Zaeh; J. Franke

doi:10.1016/j.procir.2014.01.090

Approaches for additive manufacturing of 3D electronic applications

J. Hoerber
, J. Glasschroeder
, M. Pfeffer
, J. Schilp
, M. Zaeh
, J. Franke

Friedrich-Alexander Universitat Erlangen-Nurnberg (FAU)
Institute for Machine Tools and Industrial Management (iwb)

Research output: Contribution to journal › Conference article › peer-review

105 Scopus citations

Abstract

Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.

Original language	English
Pages (from-to)	806-811
Number of pages	6
Journal	Procedia CIRP
Volume	17
DOIs	https://doi.org/10.1016/j.procir.2014.01.090
State	Published - 2014
Externally published	Yes
Event	47th CIRP Conference on Manufacturing Systems, CMS 2014 - Windsor, ON, Canada Duration: 28 Apr 2014 → 30 Apr 2014

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

3D electronic devices
Additive manufacturing
Aerosol Jet printing
Integration
Powder bed-based printing
Printed electronics

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10.1016/j.procir.2014.01.090

Cite this

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title = "Approaches for additive manufacturing of 3D electronic applications",

abstract = "Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.",

keywords = "3D electronic devices, Additive manufacturing, Aerosol Jet printing, Integration, Powder bed-based printing, Printed electronics",

author = "J. Hoerber and J. Glasschroeder and M. Pfeffer and J. Schilp and M. Zaeh and J. Franke",

note = "Funding Information: The results presented were gathered within the project 3DAMEEA. This research and development project is funded by the German Federal Ministry of Economics and Technology (BMWi) within the grant 16INE029. Furthermore, the authors would like to thank Dr M. Hedges (Neotech Services), Dr D. G{\"u}nther (Voxeljet AG), E. Lotter (LP Montagetechnik), and Dr T. Krebs (Mecadtron) for their valuable contribution. The authors are deeply grateful for this support and are responsible for the content of this publication.; 47th CIRP Conference on Manufacturing Systems, CMS 2014 ; Conference date: 28-04-2014 Through 30-04-2014",

year = "2014",

doi = "10.1016/j.procir.2014.01.090",

language = "English",

volume = "17",

pages = "806--811",

journal = "Procedia CIRP",

issn = "2212-8271",

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T1 - Approaches for additive manufacturing of 3D electronic applications

AU - Hoerber, J.

AU - Glasschroeder, J.

AU - Pfeffer, M.

AU - Schilp, J.

AU - Zaeh, M.

AU - Franke, J.

N1 - Funding Information: The results presented were gathered within the project 3DAMEEA. This research and development project is funded by the German Federal Ministry of Economics and Technology (BMWi) within the grant 16INE029. Furthermore, the authors would like to thank Dr M. Hedges (Neotech Services), Dr D. Günther (Voxeljet AG), E. Lotter (LP Montagetechnik), and Dr T. Krebs (Mecadtron) for their valuable contribution. The authors are deeply grateful for this support and are responsible for the content of this publication.

PY - 2014

Y1 - 2014

N2 - Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.

AB - Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.

KW - 3D electronic devices

KW - Additive manufacturing

KW - Aerosol Jet printing

KW - Integration

KW - Powder bed-based printing

KW - Printed electronics

UR - https://www.scopus.com/pages/publications/84904504287

U2 - 10.1016/j.procir.2014.01.090

DO - 10.1016/j.procir.2014.01.090

M3 - Conference article

AN - SCOPUS:84904504287

SN - 2212-8271

VL - 17

SP - 806

EP - 811

JO - Procedia CIRP

JF - Procedia CIRP

T2 - 47th CIRP Conference on Manufacturing Systems, CMS 2014

Y2 - 28 April 2014 through 30 April 2014

ER -

Approaches for additive manufacturing of 3D electronic applications

Abstract

UN SDGs

Keywords

Access to Document

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