TY - GEN
T1 - Analysis of the Coupling Mechanism between Airborne MEMS Ultrasonic Transducers and Ultrasonic Horns
AU - Bosetti, Gabriele
AU - Hofstetter-Spona, Stefan
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - This paper presents the impact of 3D-printed ultrasonic horns on the acoustic performance of airborne membrane-based ultrasonic emitters. Starting from a validated compact model, we analyze the power transferred from the MEMS transducer to the air. We investigate the system taking into consideration three different horn geometries and show the impact of the acoustic configuration on the dynamic behavior of the membrane and on its power efficiency. This work lays the foundation towards the realization of tailored and highly efficient airborne ultrasonic systems.
AB - This paper presents the impact of 3D-printed ultrasonic horns on the acoustic performance of airborne membrane-based ultrasonic emitters. Starting from a validated compact model, we analyze the power transferred from the MEMS transducer to the air. We investigate the system taking into consideration three different horn geometries and show the impact of the acoustic configuration on the dynamic behavior of the membrane and on its power efficiency. This work lays the foundation towards the realization of tailored and highly efficient airborne ultrasonic systems.
UR - http://www.scopus.com/inward/record.url?scp=85196910806&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196910806
T3 - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
SP - 303
EP - 306
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE VERLAG GMBH
T2 - MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty
Y2 - 23 October 2023 through 25 October 2023
ER -