TY - GEN
T1 - Analysis of RF-MEMS switches in failure mode
T2 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
AU - Kuenzig, Thomas
AU - Muschol, Tatek
AU - Iannacci, Jacopo
AU - Schrag, Gabriele
AU - Wachutka, Gerhard
PY - 2014
Y1 - 2014
N2 - We present comprehensive theoretical and experimental investigations on one of the most relevant failure mechanisms in RF-MEMS switches, namely electrically induced stiction. In particular, we analyze an RF-MEMS switch equipped with an embedded active thermal recovery appliance by deriving and applying a 3D, problem-adapted, coupled finite element (FE) model including all relevant mechanical, electrical, thermal, and fluidic effects. The accuracy and predictive power of the simulations is ensured by a dedicated calibration procedure based on highly accurate characterization techniques such as white light interferometry and laser Doppler vibrometry. Applying the calibrated model, we studied the switch operation during failure and recovery in all details and identified the most important design parameters affecting its reliability with a view to improving the recovery capability as well as optimizing the overall performance towards a more robust switch design.
AB - We present comprehensive theoretical and experimental investigations on one of the most relevant failure mechanisms in RF-MEMS switches, namely electrically induced stiction. In particular, we analyze an RF-MEMS switch equipped with an embedded active thermal recovery appliance by deriving and applying a 3D, problem-adapted, coupled finite element (FE) model including all relevant mechanical, electrical, thermal, and fluidic effects. The accuracy and predictive power of the simulations is ensured by a dedicated calibration procedure based on highly accurate characterization techniques such as white light interferometry and laser Doppler vibrometry. Applying the calibrated model, we studied the switch operation during failure and recovery in all details and identified the most important design parameters affecting its reliability with a view to improving the recovery capability as well as optimizing the overall performance towards a more robust switch design.
UR - http://www.scopus.com/inward/record.url?scp=84901415101&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2014.6813812
DO - 10.1109/EuroSimE.2014.6813812
M3 - Conference contribution
AN - SCOPUS:84901415101
SN - 9781479947904
T3 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
BT - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
PB - IEEE Computer Society
Y2 - 7 April 2014 through 9 April 2014
ER -