TY - GEN
T1 - Analysis of Piezoresistive Silicon as Sense Element for use in Flexible Tactile Sensors
AU - Verma, Vartika
AU - Ahmed, Eslam
AU - Kovac, Nicola
AU - Landesberger, Christof
AU - Gieser, Horst
AU - Brederlow, Ralf
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper presents the bending analysis of stress-sensor chips of 300 μm and 100 μm thickness. Previous work on similar topics is usually heavily focused on ultra-thin chips (≤20 μm) and their reliability analysis for flexible applications. This paper aims to prove that flexible tactile sensors can be made using silicon resistors as the primary stress elements and can demonstrate good results even at intermediate thickness levels. The silicon resistors show a linear temperature response and can be oriented to have directional stress sensitivity, proving superior to other organic sensors. The motivation behind this research is to make the tactile sensor solely using CMOS circuits and, therefore, integrate both the sensor and the readout circuitry in one chip. This is extremely useful if the tactile sensors are used on a large scale and must be fabricated commercially using existing infrastructure.
AB - This paper presents the bending analysis of stress-sensor chips of 300 μm and 100 μm thickness. Previous work on similar topics is usually heavily focused on ultra-thin chips (≤20 μm) and their reliability analysis for flexible applications. This paper aims to prove that flexible tactile sensors can be made using silicon resistors as the primary stress elements and can demonstrate good results even at intermediate thickness levels. The silicon resistors show a linear temperature response and can be oriented to have directional stress sensitivity, proving superior to other organic sensors. The motivation behind this research is to make the tactile sensor solely using CMOS circuits and, therefore, integrate both the sensor and the readout circuitry in one chip. This is extremely useful if the tactile sensors are used on a large scale and must be fabricated commercially using existing infrastructure.
KW - chip-on-foil (CoF)
KW - CMOS Stress sensor
KW - flexible electronics
KW - hybrid integration
KW - piezoresistive sensor
UR - http://www.scopus.com/inward/record.url?scp=85215309540&partnerID=8YFLogxK
U2 - 10.1109/SENSORS60989.2024.10785001
DO - 10.1109/SENSORS60989.2024.10785001
M3 - Conference contribution
AN - SCOPUS:85215309540
T3 - Proceedings of IEEE Sensors
BT - 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE Sensors, SENSORS 2024
Y2 - 20 October 2024 through 23 October 2024
ER -