Analog design challenges and trade-offs using emerging materials and devices

M. Fulde; A. Mercha; C. Gustin; B. Parvais; V. Subramanian; K. V. Arnim; F. Bauer; K. Schruefer; D. Schmitt-Landsiedel; G. Knoblingert

doi:10.1109/ESSDERC.2007.4430894

Analog design challenges and trade-offs using emerging materials and devices

M. Fulde
, A. Mercha
, C. Gustin
, B. Parvais
, V. Subramanian
, K. V. Arnim
, F. Bauer
, K. Schruefer
, D. Schmitt-Landsiedel
, G. Knoblingert

Medicine and Health

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or Multiple-Gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and V_T stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO₂ dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient V_T instabilities in the range of 10mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.

Original language	English
Title of host publication	ESSDERC - 2007 37th European Solid State Device Research Conference
Publisher	IEEE Computer Society
Pages	123-126
Number of pages	4
ISBN (Print)	1424411238, 9781424411238
DOIs	https://doi.org/10.1109/ESSDERC.2007.4430894
State	Published - 2007
Event	ESSDERC 2007 - 37th European Solid-State Device Research Conference - Munich, Germany Duration: 11 Sep 2007 → 13 Sep 2007

Publication series

Name	ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference
Volume	2007

Conference

Conference	ESSDERC 2007 - 37th European Solid-State Device Research Conference
Country/Territory	Germany
City	Munich
Period	11/09/07 → 13/09/07

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10.1109/ESSDERC.2007.4430894

Cite this

Fulde, M., Mercha, A., Gustin, C., Parvais, B., Subramanian, V., Arnim, K. V., Bauer, F., Schruefer, K., Schmitt-Landsiedel, D., & Knoblingert, G. (2007). Analog design challenges and trade-offs using emerging materials and devices. In ESSDERC - 2007 37th European Solid State Device Research Conference (pp. 123-126). Article 4430894 (ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference; Vol. 2007). IEEE Computer Society. https://doi.org/10.1109/ESSDERC.2007.4430894

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title = "Analog design challenges and trade-offs using emerging materials and devices",

abstract = "Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or Multiple-Gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and VT stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO2 dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient VT instabilities in the range of 10mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.",

author = "M. Fulde and A. Mercha and C. Gustin and B. Parvais and V. Subramanian and Arnim, \{K. V.\} and F. Bauer and K. Schruefer and D. Schmitt-Landsiedel and G. Knoblingert",

year = "2007",

doi = "10.1109/ESSDERC.2007.4430894",

language = "English",

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series = "ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference",

publisher = "IEEE Computer Society",

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booktitle = "ESSDERC - 2007 37th European Solid State Device Research Conference",

note = "ESSDERC 2007 - 37th European Solid-State Device Research Conference ; Conference date: 11-09-2007 Through 13-09-2007",

}

Fulde, M, Mercha, A, Gustin, C, Parvais, B, Subramanian, V, Arnim, KV, Bauer, F, Schruefer, K, Schmitt-Landsiedel, D & Knoblingert, G 2007, Analog design challenges and trade-offs using emerging materials and devices. in ESSDERC - 2007 37th European Solid State Device Research Conference., 4430894, ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference, vol. 2007, IEEE Computer Society, pp. 123-126, ESSDERC 2007 - 37th European Solid-State Device Research Conference, Munich, Germany, 11/09/07. https://doi.org/10.1109/ESSDERC.2007.4430894

Analog design challenges and trade-offs using emerging materials and devices. / Fulde, M.; Mercha, A.; Gustin, C. et al.
ESSDERC - 2007 37th European Solid State Device Research Conference. IEEE Computer Society, 2007. p. 123-126 4430894 (ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference; Vol. 2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Fulde, M.

AU - Mercha, A.

AU - Gustin, C.

AU - Parvais, B.

AU - Subramanian, V.

AU - Arnim, K. V.

AU - Bauer, F.

AU - Schruefer, K.

AU - Schmitt-Landsiedel, D.

AU - Knoblingert, G.

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AB - Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or Multiple-Gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and VT stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO2 dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient VT instabilities in the range of 10mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.

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M3 - Conference contribution

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ER -

Fulde M, Mercha A, Gustin C, Parvais B, Subramanian V, Arnim KV et al. Analog design challenges and trade-offs using emerging materials and devices. In ESSDERC - 2007 37th European Solid State Device Research Conference. IEEE Computer Society. 2007. p. 123-126. 4430894. (ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference). doi: 10.1109/ESSDERC.2007.4430894

Analog design challenges and trade-offs using emerging materials and devices

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