A process for inserting chips into planar microwave structures on semiconductor substrates

V. Güngerich; R. Schadel; R. Ramisch; P. Russer

doi:10.1016/S0167-9317(05)80005-X

A process for inserting chips into planar microwave structures on semiconductor substrates

V. Güngerich, R. Schadel, R. Ramisch, P. Russer

Technical University of Munich

Technical University of Munich

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.

Original language	English
Pages (from-to)	247-252
Number of pages	6
Journal	Microelectronic Engineering
Volume	18
Issue number	3
DOIs	https://doi.org/10.1016/S0167-9317(05)80005-X
State	Published - Aug 1992

Keywords

GaAs wet etching
Thin film technology
hybrid mounting technique

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title = "A process for inserting chips into planar microwave structures on semiconductor substrates",

abstract = "A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.",

keywords = "GaAs wet etching, Thin film technology, hybrid mounting technique",

author = "V. G{\"u}ngerich and R. Schadel and R. Ramisch and P. Russer",

note = "Funding Information: The authors thank Mrs. Peterschik for technical assistance. This work was supported by the Deutsche Forschungsgemeinschaft (DFG).",

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T1 - A process for inserting chips into planar microwave structures on semiconductor substrates

AU - Güngerich, V.

AU - Schadel, R.

AU - Ramisch, R.

AU - Russer, P.

N1 - Funding Information: The authors thank Mrs. Peterschik for technical assistance. This work was supported by the Deutsche Forschungsgemeinschaft (DFG).

PY - 1992/8

Y1 - 1992/8

N2 - A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.

AB - A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.

KW - GaAs wet etching

KW - Thin film technology

KW - hybrid mounting technique

UR - http://www.scopus.com/inward/record.url?scp=0026907863&partnerID=8YFLogxK

U2 - 10.1016/S0167-9317(05)80005-X

DO - 10.1016/S0167-9317(05)80005-X

M3 - Article

AN - SCOPUS:0026907863

SN - 0167-9317

VL - 18

SP - 247

EP - 252

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 3

ER -

A process for inserting chips into planar microwave structures on semiconductor substrates

Abstract

Keywords

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