TY - JOUR
T1 - A process for inserting chips into planar microwave structures on semiconductor substrates
AU - Güngerich, V.
AU - Schadel, R.
AU - Ramisch, R.
AU - Russer, P.
N1 - Funding Information:
The authors thank Mrs. Peterschik for technical assistance. This work was supported by the Deutsche Forschungsgemeinschaft (DFG).
PY - 1992/8
Y1 - 1992/8
N2 - A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.
AB - A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.
KW - GaAs wet etching
KW - Thin film technology
KW - hybrid mounting technique
UR - http://www.scopus.com/inward/record.url?scp=0026907863&partnerID=8YFLogxK
U2 - 10.1016/S0167-9317(05)80005-X
DO - 10.1016/S0167-9317(05)80005-X
M3 - Article
AN - SCOPUS:0026907863
SN - 0167-9317
VL - 18
SP - 247
EP - 252
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 3
ER -