TY - GEN
T1 - A Physics-Based Interpolation Method for Rapid Dimensioning of pMUT Designs
AU - Bajt, Aleksander
AU - Bosetti, Gabriele
AU - Poongodan, Prajith Kumar
AU - Schrag, Gabriele
AU - Vanselow, Frank
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this paper, we present an interpolation method based on analytical physics-based equations aimed towards rapid prototyping of fluid-operated piezoelectrical micromachined ultrasonic transducers (pMUTs). The method allows for the definition of design variants, whose natural frequencies match the targeted operating frequency, within a predefined geometrical parameter range. Among those designs, an optimal design w.r.t the largest transmitting sensitivity can be determined. Comparison between FEM simulations and interpolation results shows a maximum relative error of 2.96% for the resonant frequency matching. Due to generic and physics-based concept, this methodology is easily transferable to the target-based optimization of any arbitrary pMUT geometry and operating media.
AB - In this paper, we present an interpolation method based on analytical physics-based equations aimed towards rapid prototyping of fluid-operated piezoelectrical micromachined ultrasonic transducers (pMUTs). The method allows for the definition of design variants, whose natural frequencies match the targeted operating frequency, within a predefined geometrical parameter range. Among those designs, an optimal design w.r.t the largest transmitting sensitivity can be determined. Comparison between FEM simulations and interpolation results shows a maximum relative error of 2.96% for the resonant frequency matching. Due to generic and physics-based concept, this methodology is easily transferable to the target-based optimization of any arbitrary pMUT geometry and operating media.
UR - http://www.scopus.com/inward/record.url?scp=85129537299&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758862
DO - 10.1109/EuroSimE54907.2022.9758862
M3 - Conference contribution
AN - SCOPUS:85129537299
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -