TY - GEN
T1 - A Path Selection Flow for Functional Path Ring Oscillators using Physical Design Data
AU - Kilian, Tobias
AU - Hanel, Markus
AU - Tille, Daniel
AU - Huch, Martin
AU - Schlichtmann, Ulf
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - A lot of effort and money is invested in testing to ensure zero-defect quality of automotive microcontrollers. One crucial test is the performance screening. Indirect structures such as Ring Oscillators (ROs) are used for this. Here, the quality of the performance screening strongly depends on the quality and selection of the RO structures used. This paper proposes a path selection and implementation method to provide a set of functional path ROs with good representativeness for the whole chip. In addition, a simulation-based validation is presented, which is used to improve the selection process continually. The proposed path selection is validated by simulation and on silicon. The results show a high diversity and good coverage of the chip parameters with the selected functional path ROs, providing good conditions for a high-quality performance screening.
AB - A lot of effort and money is invested in testing to ensure zero-defect quality of automotive microcontrollers. One crucial test is the performance screening. Indirect structures such as Ring Oscillators (ROs) are used for this. Here, the quality of the performance screening strongly depends on the quality and selection of the RO structures used. This paper proposes a path selection and implementation method to provide a set of functional path ROs with good representativeness for the whole chip. In addition, a simulation-based validation is presented, which is used to improve the selection process continually. The proposed path selection is validated by simulation and on silicon. The results show a high diversity and good coverage of the chip parameters with the selected functional path ROs, providing good conditions for a high-quality performance screening.
UR - http://www.scopus.com/inward/record.url?scp=85146146230&partnerID=8YFLogxK
U2 - 10.1109/ITC50671.2022.00034
DO - 10.1109/ITC50671.2022.00034
M3 - Conference contribution
AN - SCOPUS:85146146230
T3 - Proceedings - International Test Conference
SP - 258
EP - 267
BT - Proceedings - 2022 IEEE International Test Conference, ITC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE International Test Conference, ITC 2022
Y2 - 23 September 2022 through 30 September 2022
ER -