TY - GEN
T1 - A novel silicon 'star-comb' microphone concept for enhanced signal-to-noise-ratio
T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
AU - Manz, Johannes
AU - Bosetti, Gabriele
AU - Dehe, Alfons
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/26
Y1 - 2017/7/26
N2 - A novel comb-structure-based, capacitive MEMS microphone concept is proposed, which is expected to significantly reduce viscous damping losses, challenging the high performance of conventional MEMS microphones. To this end, we derived a dedicated, fully energy-coupled and properly calibrated system-level model scaling with all relevant design parameters. It enables to discriminate in detail the impact of the individual components like transducer, package and electrostatic read out to the overall signal-to-noise-ratio (SNR) of the microphone and hence, to identify the optimal design of the device. Measurements of first prototypes show promising results and agree very well with simulations demonstrating the predictive power of the model w.r.t. to further optimization.
AB - A novel comb-structure-based, capacitive MEMS microphone concept is proposed, which is expected to significantly reduce viscous damping losses, challenging the high performance of conventional MEMS microphones. To this end, we derived a dedicated, fully energy-coupled and properly calibrated system-level model scaling with all relevant design parameters. It enables to discriminate in detail the impact of the individual components like transducer, package and electrostatic read out to the overall signal-to-noise-ratio (SNR) of the microphone and hence, to identify the optimal design of the device. Measurements of first prototypes show promising results and agree very well with simulations demonstrating the predictive power of the model w.r.t. to further optimization.
KW - Silicon microphone
KW - comb structure
KW - modeling
KW - noise
KW - signal-to-noise-ratio (SNR)
KW - system simulation
UR - http://www.scopus.com/inward/record.url?scp=85027856587&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2017.7993989
DO - 10.1109/TRANSDUCERS.2017.7993989
M3 - Conference contribution
AN - SCOPUS:85027856587
T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 67
EP - 70
BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 June 2017 through 22 June 2017
ER -