A new process for flip-chip interconnections with variable stand-offs

O. S. Kessling, F. Schüßler, K. Feldmann, T. C. Lueth

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

This paper presents a new process to improve the reliability of solder connections of miniaturized flip-chips by creating a variable stand-off using jetting technology. This technology is used to generate precise solder volumes. Thereby the solder is jetted directly on the printed circuit board. To increase the stand-off several solder bumps can be jetted on top of each other. The flip-chips are processed with no flow underfill to reduce process steps and to prevent short circuits between solder joints. The state of the art is shortly presented and the function principle of the print head is explained. Measurements of the printed solder balls and solder columns are presented. The flip-chip alignment and the dispensing of the underfill are investigated. The interconnection between the chip and substrate is approved by daisy chain measurements and the enhanced stand-off is measured with laser triangulation.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages620-625
Number of pages6
DOIs
StatePublished - 2008
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: 9 Dec 200812 Dec 2008

Publication series

Name10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
Country/TerritorySingapore
CitySingapore
Period9/12/0812/12/08

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