@inproceedings{a7a12a74620d4a408d6e78713d1a4440,
title = "A new process for flip-chip interconnections with variable stand-offs",
abstract = "This paper presents a new process to improve the reliability of solder connections of miniaturized flip-chips by creating a variable stand-off using jetting technology. This technology is used to generate precise solder volumes. Thereby the solder is jetted directly on the printed circuit board. To increase the stand-off several solder bumps can be jetted on top of each other. The flip-chips are processed with no flow underfill to reduce process steps and to prevent short circuits between solder joints. The state of the art is shortly presented and the function principle of the print head is explained. Measurements of the printed solder balls and solder columns are presented. The flip-chip alignment and the dispensing of the underfill are investigated. The interconnection between the chip and substrate is approved by daisy chain measurements and the enhanced stand-off is measured with laser triangulation.",
author = "Kessling, {O. S.} and F. Sch{\"u}{\ss}ler and K. Feldmann and Lueth, {T. C.}",
year = "2008",
doi = "10.1109/EPTC.2008.4763502",
language = "English",
isbn = "9781424421183",
series = "10th Electronics Packaging Technology Conference, EPTC 2008",
pages = "620--625",
booktitle = "10th Electronics Packaging Technology Conference, EPTC 2008",
note = "10th Electronics Packaging Technology Conference, EPTC 2008 ; Conference date: 09-12-2008 Through 12-12-2008",
}