A modular high temperature measurement set-up for semiconductor device characterization

Peter Borthen; Gerhard Wachutka

doi:10.1109/THERMINIC.2007.4451775

A modular high temperature measurement set-up for semiconductor device characterization

Peter Borthen, Gerhard Wachutka

Computation, Information and Technology

Technical University of Munich

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500°C and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.

Original language	English
Title of host publication	Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007
Pages	189-194
Number of pages	6
DOIs	https://doi.org/10.1109/THERMINIC.2007.4451775
State	Published - 2007
Event	13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007 - Budapest, Hungary Duration: 17 Sep 2007 → 19 Sep 2007

Publication series

Name	Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Conference

Conference	13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007
Country/Territory	Hungary
City	Budapest
Period	17/09/07 → 19/09/07

Access to Document

10.1109/THERMINIC.2007.4451775

Cite this

Borthen, P., & Wachutka, G. (2007). A modular high temperature measurement set-up for semiconductor device characterization. In Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007 (pp. 189-194). Article 4451775 (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC). https://doi.org/10.1109/THERMINIC.2007.4451775

Borthen, Peter ; Wachutka, Gerhard. / A modular high temperature measurement set-up for semiconductor device characterization. Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007. 2007. pp. 189-194 (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC).

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title = "A modular high temperature measurement set-up for semiconductor device characterization",

abstract = "We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500°C and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.",

author = "Peter Borthen and Gerhard Wachutka",

year = "2007",

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language = "English",

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booktitle = "Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007",

note = "13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007 ; Conference date: 17-09-2007 Through 19-09-2007",

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Borthen, P & Wachutka, G 2007, A modular high temperature measurement set-up for semiconductor device characterization. in Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007., 4451775, Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC, pp. 189-194, 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007, Budapest, Hungary, 17/09/07. https://doi.org/10.1109/THERMINIC.2007.4451775

A modular high temperature measurement set-up for semiconductor device characterization. / Borthen, Peter; Wachutka, Gerhard.
Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007. 2007. p. 189-194 4451775 (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Borthen P, Wachutka G. A modular high temperature measurement set-up for semiconductor device characterization. In Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007. 2007. p. 189-194. 4451775. (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC). doi: 10.1109/THERMINIC.2007.4451775

A modular high temperature measurement set-up for semiconductor device characterization

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