TY - GEN
T1 - A fast pneumatic droplet generator for the ejection of molten aluminum
AU - Rumschoettel, Dominik
AU - Griebel, Benjamin
AU - Irlinger, Franz
AU - Lueth, Tim C.
N1 - Publisher Copyright:
© 2017 SMTA.
PY - 2017/2/21
Y1 - 2017/2/21
N2 - Contactless dosing of minute amounts of molten metals in the form of micron sized droplets is a promising technology with applications in the area of three dimensional printing (3DP) and electronics manufacturing. However the generation of droplets of higher melting point metals, such as aluminum and its alloys, has proven to be a challenging task. Difficulties arise mainly due to the high temperatures needed to get the metal into its liquid state and the inherent chemical aggressiveness of fluids like molten aluminum with its high reduction potential. Those conditions preclude the use of most of the common drop-on-demand (DoD) operating principles for the generation of metal droplets.
AB - Contactless dosing of minute amounts of molten metals in the form of micron sized droplets is a promising technology with applications in the area of three dimensional printing (3DP) and electronics manufacturing. However the generation of droplets of higher melting point metals, such as aluminum and its alloys, has proven to be a challenging task. Difficulties arise mainly due to the high temperatures needed to get the metal into its liquid state and the inherent chemical aggressiveness of fluids like molten aluminum with its high reduction potential. Those conditions preclude the use of most of the common drop-on-demand (DoD) operating principles for the generation of metal droplets.
KW - additive manufacturing
KW - drop-on-demand (DoD)
KW - metal jetting
KW - pneumatic droplet generator
UR - http://www.scopus.com/inward/record.url?scp=85015802470&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85015802470
T3 - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
BT - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
Y2 - 6 February 2017 through 9 February 2017
ER -