Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 2 Zero Hunger -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 11 Sustainable Cities and Communities
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Dive into the research topics where Andreas Herkersdorf is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Projects
- 1 Finished
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HyperNIC: NIC-Level Co-Processors for Resilient Coded Networking and Computation
Carle, G. (PI), Herkersdorf, A. (CoPI), Gallenmüller, S. (CoI), Simon, M. (CoI), Lachnit, S. (CoI) & Holzinger, K. (CoI)
1/07/23 → 30/06/26
Project: Research
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6G network design and operations
Mehmeti, F., Biersack, F., Liess, M., Nickel, M., Doan, T. V., Khasanov, R., Castrillon, J., Lhamo, O., Wild, T., Herkersdorf, A., Kellerer, W., Fitzek, F. H. P., Nguyen, G. T. & Göhringer, D., 1 Jan 2026, 6G-life: Unveiling the Future of Technological Sovereignty, Sustainability, and Trustworthiness. Elsevier, p. 135-149 15 p.Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review
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Demo: Predictive Maintenance without Maintenance
Kindt, P. H., Gaiardelli, S., Caccamo, M., Wild, T., Herkersdorf, A. & Chakraborty, S., 2026, Proceedings - 2026 IEEE 32nd International Conference on Embedded and Real-Time Computing Systems and Applications, RTCSA 2026. Institute of Electrical and Electronics Engineers Inc., p. 232-233 2 p. (Proceedings - 2026 IEEE 32nd International Conference on Embedded and Real-Time Computing Systems and Applications, RTCSA 2026).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center
Amrouch, H., Joseph, J., Schirmer, M., Geier, J., Schlichtmann, U., Meidinger, M., Wild, T., Herkersdorf, A., Nopel, J., Sigl, G., Zhang, Y., Trinitis, C., Sankaranarayanan, A. N., Schulz, M., Korb, A. & Hohentanner, K., 2026, 2026 Design, Automation and Test in Europe Conference, DATE 2026 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Packet Fragmentation for Low Latency Block-based FEC
Wulff, W., Wild, T. & Herkersdorf, A., 2026, In: Proceedings - International Conference on Computer Communications and Networks, ICCCN. 2026Research output: Contribution to journal › Conference article › peer-review
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Reflex-enhanced computing for adaptive 6G hardware
Liess, M., Demicoli, J., Tiedje, T., Lohrmann, M. A., Nickel, M., Luniak, M., Prousalis, D., Wild, T., Tetzlaff, R., Göhringer, D., Mayr, C., Bock, K., Steinhorst, S. & Herkersdorf, A., 1 Jan 2026, 6G-life: Unveiling the Future of Technological Sovereignty, Sustainability, and Trustworthiness. Elsevier, p. 379-400 22 p.Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review