Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Classifying figures and illustrations in electronics datasheets: A comparative evaluation of recent computer vision models on a custom collection of 4000 technical documents
Perakis, L., Balling, J., Binder, F., Heyer, G. & Kreupl, F., 2023, INFORMATIK 2023 - Designing Futures: Zukunfte gestalten, Proceedings. Klein, M., Krupka, D., Winter, C. & Wohlgemuth, V. (eds.). Gesellschaft fur Informatik (GI), p. 1835-1850 16 p. (Lecture Notes in Informatics (LNI), Proceedings - Series of the Gesellschaft fur Informatik (GI); vol. P-337).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A cost-effective, impediometric Na+-Sensor in fluids
Pfeffer, C., Zips, S., Muellner, E., Hefele, M., Kreupl, F., Wolf, B., Wolfrum, B., Liang, Y. & Brederlow, R., Jun 2021, In: IEEE Sensors Letters. 5, 6, 9387556.Research output: Contribution to journal › Article › peer-review
7 Scopus citations -
A CMOS Temperature Stabilized 2-D Mechanical Stress Sensor with 11-bit Resolution
Nurmetov, U., Fritz, T., Mullner, E., Dougherty, C. M., Szelong, M., Kreupl, F. & Brederlow, R., Apr 2020, In: IEEE Journal of Solid-State Circuits. 55, 4, p. 846-855 10 p., 8984225.Research output: Contribution to journal › Article › peer-review
12 Scopus citations