Wireless life cycle monitoring in the injection molded part

Matthias Zeppenfeld, Rupert Hirn, Maximilian Wardenberg, Markus Eblenkamp

Publikation: Beitrag in Periodikum › Artikel

1 Zitat (Scopus)

Andere Dateien und Links

@misc{34b477b3d25446ada7b89db699d8a124,

title = "Wireless life cycle monitoring in the injection molded part",

author = "Matthias Zeppenfeld and Rupert Hirn and Maximilian Wardenberg and Markus Eblenkamp",

year = "2019",

language = "English",

volume = "109",

pages = "11--16",

journal = "Kunststoffe International",

issn = "1862-4243",

publisher = "Carl Hanser Verlag",

}

TY - GEN

T1 - Wireless life cycle monitoring in the injection molded part

AU - Zeppenfeld, Matthias

AU - Hirn, Rupert

AU - Wardenberg, Maximilian

AU - Eblenkamp, Markus

PY - 2019

Y1 - 2019

UR - http://www.scopus.com/inward/record.url?scp=85066491210&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:85066491210

SN - 1862-4243

VL - 109

SP - 11

EP - 16

JO - Kunststoffe International

JF - Kunststoffe International

ER -