Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang, Stevan S. Djordjecvic, Jin Yao, John E. Cunningham, Xuezhe Zheng, Ashok V. Krishnamoorthy, Michael Muller, Markus Christian Amann, Richard Bojko, Nicolas A.F. Jaeger, Lukas Chrostowski

Lehrstuhl für Halbleitertechnologie

University of British Columbia
Oracle America, Inc.
Walter Schottky Institut
University of Washington

Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Fingerprint

Keyphrases

Engineering

Physics