Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang; Stevan S. Djordjecvic; Jin Yao; John E. Cunningham; Xuezhe Zheng; Ashok V. Krishnamoorthy; Michael Muller; Markus Christian Amann; Richard Bojko; Nicolas A.F. Jaeger; Lukas Chrostowski

doi:10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang, Stevan S. Djordjecvic, Jin Yao, John E. Cunningham, Xuezhe Zheng, Ashok V. Krishnamoorthy, Michael Muller, Markus Christian Amann, Richard Bojko, Nicolas A.F. Jaeger, Lukas Chrostowski

Lehrstuhl für Halbleitertechnologie

Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

17 Zitate (Scopus)

Abstract

We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

Originalsprache	Englisch
Titel	2015 IEEE Optical Interconnects Conference, OI 2015
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers Inc.
Seiten	122-123
Seitenumfang	2
ISBN (elektronisch)	9781479981793
DOIs	https://doi.org/10.1109/OIC.2015.7115716
Publikationsstatus	Veröffentlicht - 29 Mai 2015
Veranstaltung	2015 IEEE Optical Interconnects Conference, OI 2015 - San Diego, USA/Vereinigte Staaten Dauer: 20 Apr. 2015 → 22 Apr. 2015

Publikationsreihe

Name	2015 IEEE Optical Interconnects Conference, OI 2015

Konferenz

Konferenz	2015 IEEE Optical Interconnects Conference, OI 2015
Land/Gebiet	USA/Vereinigte Staaten
Ort	San Diego
Zeitraum	20/04/15 → 22/04/15

Zugriff auf Dokument

10.1109/OIC.2015.7115716

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

Dieses zitieren

Wang, Y., Djordjecvic, S. S., Yao, J., Cunningham, J. E., Zheng, X., Krishnamoorthy, A. V., Muller, M., Amann, M. C., Bojko, R., Jaeger, N. A. F., & Chrostowski, L. (2015). Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. in 2015 IEEE Optical Interconnects Conference, OI 2015 (S. 122-123). Artikel 7115716 (2015 IEEE Optical Interconnects Conference, OI 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OIC.2015.7115716

@inproceedings{e62ed888a1414e349ddc88ea328249ec,

title = "Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip",

abstract = "We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.",

author = "Yun Wang and Djordjecvic, {Stevan S.} and Jin Yao and Cunningham, {John E.} and Xuezhe Zheng and Krishnamoorthy, {Ashok V.} and Michael Muller and Amann, {Markus Christian} and Richard Bojko and Jaeger, {Nicolas A.F.} and Lukas Chrostowski",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 IEEE Optical Interconnects Conference, OI 2015 ; Conference date: 20-04-2015 Through 22-04-2015",

year = "2015",

month = may,

day = "29",

doi = "10.1109/OIC.2015.7115716",

language = "English",

series = "2015 IEEE Optical Interconnects Conference, OI 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "122--123",

booktitle = "2015 IEEE Optical Interconnects Conference, OI 2015",

}

Wang, Y, Djordjecvic, SS, Yao, J, Cunningham, JE, Zheng, X, Krishnamoorthy, AV, Muller, M, Amann, MC, Bojko, R, Jaeger, NAF & Chrostowski, L 2015, Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. in 2015 IEEE Optical Interconnects Conference, OI 2015., 7115716, 2015 IEEE Optical Interconnects Conference, OI 2015, Institute of Electrical and Electronics Engineers Inc., S. 122-123, 2015 IEEE Optical Interconnects Conference, OI 2015, San Diego, USA/Vereinigte Staaten, 20/04/15. https://doi.org/10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. / Wang, Yun; Djordjecvic, Stevan S.; Yao, Jin et al.
2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc., 2015. S. 122-123 7115716 (2015 IEEE Optical Interconnects Conference, OI 2015).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

TY - GEN

T1 - Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

AU - Wang, Yun

AU - Djordjecvic, Stevan S.

AU - Yao, Jin

AU - Cunningham, John E.

AU - Zheng, Xuezhe

AU - Krishnamoorthy, Ashok V.

AU - Muller, Michael

AU - Amann, Markus Christian

AU - Bojko, Richard

AU - Jaeger, Nicolas A.F.

AU - Chrostowski, Lukas

PY - 2015/5/29

Y1 - 2015/5/29

N2 - We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

AB - We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

UR - http://www.scopus.com/inward/record.url?scp=84936930931&partnerID=8YFLogxK

U2 - 10.1109/OIC.2015.7115716

DO - 10.1109/OIC.2015.7115716

M3 - Conference contribution

AN - SCOPUS:84936930931

T3 - 2015 IEEE Optical Interconnects Conference, OI 2015

SP - 122

EP - 123

BT - 2015 IEEE Optical Interconnects Conference, OI 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 IEEE Optical Interconnects Conference, OI 2015

Y2 - 20 April 2015 through 22 April 2015

ER -

Wang Y, Djordjecvic SS, Yao J, Cunningham JE, Zheng X, Krishnamoorthy AV et al. Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. in 2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc. 2015. S. 122-123. 7115716. (2015 IEEE Optical Interconnects Conference, OI 2015). doi: 10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Abstract

Publikationsreihe

Konferenz

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Dieses zitieren