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Thermal stability of wood-wood and Wood-FRP bonding with polyurethane and epoxy adhesives

Publikation: Beitrag in FachzeitschriftArtikelBegutachtung

57 Zitate (Scopus)

Abstract

The temperature-dependent creep of different polyurethane (PUR) and epoxy (EP) adhesives was investigated in relation to glue line thickness. A water-based hydroxymethylated resorcinol coupling agent was developed which improves the delaminating resistance of PUR and EP adhesives. The results show that crosslinked polymers of PUR and EP adhesives display significant viscoelastic responses over temperature ranges that are relevant for practical applications. Thus, temperature-dependent creep is a risk factor that needs to be considered for structural applications.

OriginalspracheEnglisch
Seiten (von - bis)419-426
Seitenumfang8
FachzeitschriftAdvanced Engineering Materials
Jahrgang7
Ausgabenummer5
DOIs
PublikationsstatusVeröffentlicht - Mai 2005
Extern publiziertJa

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