@inproceedings{969a708f7cd44962a36956a92405b424,
title = "The Influence of Asymmetric Printed-Circuit-Board Layout on the Reliability of Power Electronic Circuits",
abstract = "Within the development of automotive power electronics often spatial requirements lead to asymmetric design of Printed-Circuit-Boards (PCBs). These asymmetries can lead to thermal coupling and in the following to asymmetric thermal loading limiting the reliability of the semiconductor components. This article aims to examine the influence of these asymmetries on the lifetime of a power converter qualitatively and quantitatively through a mission-profile-based electrical and thermal simulation and damage calculation.",
keywords = "Design optimization, Dual Active Bridge Converter, Mission Profile, Reliability",
author = "Mueller, {Max V.} and Schirmer, {Pascal A.} and Peter Schreivogel and Heldwein, {Marcelo Lobo}",
note = "Publisher Copyright: {\textcopyright} 2023 EPE Association.; 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe ; Conference date: 04-09-2023 Through 08-09-2023",
year = "2023",
doi = "10.23919/EPE23ECCEEurope58414.2023.10264430",
language = "English",
series = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",
}