Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics

Fandi Bi, Birgit Vogel-Heuser, Fengmin Du, Nils Hanich, Ennuri Cho

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

Abstract

Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses significant risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that cause greater ripple effects to the TD distribution. When quantifying TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove applicable. In this work, we propose a method containing two key metrics to quantify TD contagiousness across product life cycles and disciplines. Furthermore, we suggest a matrix multiplication method to quantify the adverse impact on each discipline and the system. By applying the methods to the data of three comparable companies in the industrial automation domain, the results enable us to measure and prioritize the TD incidents' contagiousness. This method provides a first step towards the systematic quantification of TD in the interdisciplinary environment and provides metrics to compare systems based on objective factors.

OriginalspracheEnglisch
TitelProceedings - 2023 ACM/IEEE International Conference on Technical Debt, TechDebt 2023
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten42-51
Seitenumfang10
ISBN (elektronisch)9798350311945
DOIs
PublikationsstatusVeröffentlicht - 2023
Veranstaltung6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023 - Melbourne, Australien
Dauer: 14 Mai 202315 Mai 2023

Publikationsreihe

NameProceedings - 2023 ACM/IEEE International Conference on Technical Debt, TechDebt 2023

Konferenz

Konferenz6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023
Land/GebietAustralien
OrtMelbourne
Zeitraum14/05/2315/05/23

Fingerprint

Untersuchen Sie die Forschungsthemen von „Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren