Numerical analysis tool for transient skin effect problems

P. Böhm, G. Wachutka

Publikation: Beitrag in FachzeitschriftKonferenzartikelBegutachtung

6 Zitate (Scopus)

Abstract

A new numerical analysis tool for the investigation of the three-dimensional transient electromagnetic behavior of interconnect structures in high power modules is presented. The simulator uses the finite element method to receive a continuous field description of electric and magnetic fields caused by bus bars under fast operating conditions and allows for a detailed investigation of distributed parasitic effects. Time dependent current crowding, time dependent inductances, overvoltage peaks or current turn-on delays can be determined. The finite element based concept permits to consider both voltage and current-driven problems and is well suited to analyze complex plate structures as no a priori decomposition of any conductor into partial elements is needed. The interconnect analysis tool was developed by the help of the object-oriented C++ library Diffpack, a software development framework for the solution of partial differential equations. The mixed finite element method is applied to solve the skin effect problem by a combination of a vector and a scalar potential. Edge finite elements are used to discretize the vector quantity. Re-using well-tested and efficient code of the library allows to analyze complex three-dimensional bus bar arrangements.

OriginalspracheEnglisch
Seiten (von - bis)880-884
Seitenumfang5
FachzeitschriftPESC Record - IEEE Annual Power Electronics Specialists Conference
Jahrgang2
PublikationsstatusVeröffentlicht - 2004
Veranstaltung2004 IEEE 35th Annual Power Electronics Specialists Conference, PESC04 - Aachen, Deutschland
Dauer: 20 Juni 200425 Juni 2004

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