TY - GEN
T1 - New methodology for on-chip RF reliability assessment
AU - Heis, Leonhard
AU - Lachmann, Andreas
AU - Schwab, Reiner
AU - Panagopoulos, Georgios
AU - Baumgartner, Peter
AU - Virupakshappaa, Mamatha Yakkegondi
AU - Schmitt-Landsiedel, Doris
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/9/22
Y1 - 2016/9/22
N2 - This work presents a systematic approach to investigate transistor reliability at high frequencies with on-chip stress circuits. The problem of state-of-the art on-chip stress circuits is that the actual stress signal at the device cannot be verified by measurements. However, due to the exponential voltage dependency of transistor reliability mechanisms it is important to know the exact voltage of the generated stress signals. Therefore our RF reliability assessment methodology uses two test structures, one to generate AC stress signals on-chip and one to monitor these signals with an on-chip oscilloscope. The methodology is applied to study the frequency dependency of PBTI, NBTI and hot carrier degradation in a 28 nm high-k technology.
AB - This work presents a systematic approach to investigate transistor reliability at high frequencies with on-chip stress circuits. The problem of state-of-the art on-chip stress circuits is that the actual stress signal at the device cannot be verified by measurements. However, due to the exponential voltage dependency of transistor reliability mechanisms it is important to know the exact voltage of the generated stress signals. Therefore our RF reliability assessment methodology uses two test structures, one to generate AC stress signals on-chip and one to monitor these signals with an on-chip oscilloscope. The methodology is applied to study the frequency dependency of PBTI, NBTI and hot carrier degradation in a 28 nm high-k technology.
UR - http://www.scopus.com/inward/record.url?scp=84990929294&partnerID=8YFLogxK
U2 - 10.1109/IRPS.2016.7574541
DO - 10.1109/IRPS.2016.7574541
M3 - Conference contribution
AN - SCOPUS:84990929294
T3 - IEEE International Reliability Physics Symposium Proceedings
SP - 4C51-4C57
BT - 2016 International Reliability Physics Symposium, IRPS 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 International Reliability Physics Symposium, IRPS 2016
Y2 - 17 April 2016 through 21 April 2016
ER -