New methodology for on-chip RF reliability assessment

Leonhard Heis, Andreas Lachmann, Reiner Schwab, Georgios Panagopoulos, Peter Baumgartner, Mamatha Yakkegondi Virupakshappaa, Doris Schmitt-Landsiedel

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

5 Zitate (Scopus)

Abstract

This work presents a systematic approach to investigate transistor reliability at high frequencies with on-chip stress circuits. The problem of state-of-the art on-chip stress circuits is that the actual stress signal at the device cannot be verified by measurements. However, due to the exponential voltage dependency of transistor reliability mechanisms it is important to know the exact voltage of the generated stress signals. Therefore our RF reliability assessment methodology uses two test structures, one to generate AC stress signals on-chip and one to monitor these signals with an on-chip oscilloscope. The methodology is applied to study the frequency dependency of PBTI, NBTI and hot carrier degradation in a 28 nm high-k technology.

OriginalspracheEnglisch
Titel2016 International Reliability Physics Symposium, IRPS 2016
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten4C51-4C57
ISBN (elektronisch)9781467391368
DOIs
PublikationsstatusVeröffentlicht - 22 Sept. 2016
Veranstaltung2016 International Reliability Physics Symposium, IRPS 2016 - Pasadena, USA/Vereinigte Staaten
Dauer: 17 Apr. 201621 Apr. 2016

Publikationsreihe

NameIEEE International Reliability Physics Symposium Proceedings
Band2016-September
ISSN (Print)1541-7026

Konferenz

Konferenz2016 International Reliability Physics Symposium, IRPS 2016
Land/GebietUSA/Vereinigte Staaten
OrtPasadena
Zeitraum17/04/1621/04/16

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