Nature-inspired enhanced microscale heat transfer in macro geometry

Aik Ling Goh, Kim Tiow Ooi, Ulrich Stimming

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

5 Zitate (Scopus)

Abstract

To meet the high cooling demand in the electronics industry, enhanced microchannel heat sinks were introduced. However, the intricacies and high costs associated with microfabrication technologies prove them unsuitable for application in conventional heat exchangers. Hence, the motivation to implement microscale passages in macro geometries ensues. In this study, the annular microchannel is formed by securing a cylindrical insert of mean diameter 19.4 mm concentrically within a cylindrical pipe of internal diameter 20 mm. The paper looks at heat transfer enhancement techniques using inserts of nature-inspired profiles. CFD simulations based on conventional theory were carried out to predict the heat transfer and flow characteristics in the microchannel, for length of 30 mm, mean hydraulic diameter of 600 μm, and under constant heat input of 500 W. Under flow condition of 4 L/min (0.0667 kg/s), convective heat transfer coefficient values of 33.7, 32.7, 30.4 and 26.2 kW/m2·K are obtained for the Durian, Inverted Fish Scale, Fish Scale and Plain profiles respectively. This corresponds to an enhancement of 29%, 25% and 16% respectively, relative to the Plain profile. In addition, using Inverted Fish Scale profile, flow condition of 8 L/min (0.133 kg/s) yield a significant convective heat transfer coefficient value of 59.2 kW/m2·K. The pressure drop values are found to be easily met by a commercially available pump.

OriginalspracheEnglisch
TitelThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten397-403
Seitenumfang7
ISBN (elektronisch)9781479952670
DOIs
PublikationsstatusVeröffentlicht - 4 Sept. 2014
Extern publiziertJa
Veranstaltung14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, USA/Vereinigte Staaten
Dauer: 27 Mai 201430 Mai 2014

Publikationsreihe

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Konferenz

Konferenz14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Land/GebietUSA/Vereinigte Staaten
OrtOrlando
Zeitraum27/05/1430/05/14

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