Modelling technical compromises in electronics manufacturing with BPMN+TD - An industrial use case

Quang Huan Dong, Birgit Vogel-Heuser

Publikation: Beitrag in FachzeitschriftKonferenzartikelBegutachtung

7 Zitate (Scopus)

Abstract

Relocating manufacturing plants is a phenomenon nowadays due to increasing changes in markets, materials, and labour cost. Under business pressure, while transferring the manufacturing systems, some technical compromises might be taken to start the production as soon as possible. A technical shortcut can provide a short-term benefit but may introduce a long-term negative impact. This work reports an industrial use case at a world-leading electronics manufacturer during its plant relocations. The study employs the Business Process Model and Notation (BPMN) to visualize the use case. There, an enlargement of BPMN, namely BPMN+TD, is achieved to assist in modelling TD artifacts.

OriginalspracheEnglisch
Seiten (von - bis)912-917
Seitenumfang6
FachzeitschriftIFAC Proceedings Volumes (IFAC-PapersOnline)
Jahrgang54
Ausgabenummer1
DOIs
PublikationsstatusVeröffentlicht - 2021
Veranstaltung17th IFAC Symposium on Information Control Problems in Manufacturing INCOM 2021 - Budapest, Ungarn
Dauer: 7 Juni 20219 Juni 2021

Fingerprint

Untersuchen Sie die Forschungsthemen von „Modelling technical compromises in electronics manufacturing with BPMN+TD - An industrial use case“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren