@inproceedings{5ac66c07852a411184a0e1d98490d804,
title = "Modeling of Deep Rolling as a Distortion Compensation Strategy during Profile Grinding",
abstract = "This paper analyzes the possibility to induce residual compressive stresses utilizing deep rolling in a long, slim steel workpiece that is profile ground and that resembles a linear guide rail. These intentionally caused residual compressive stresses at the side surfaces of the workpiece are intended to counteract the distortion due to residual stresses in the V-groove of the guide rail induced by grinding. A finite element model was prepared based on the initial state of the workpiece. The amount of respective stresses depended on the load intensity and duration of the process. The experimental data regarding the residual stress profiles due to the deep rolling process and the resulting workpiece distortion were used to validate the simulation, so that an adjustment or a calibration of the thermometallurgical and thermomechanical material data was possible. The key findings are the numerical design of appropriate strategies for the distortion potential induction, the experimental distortion results, knowledge on the mechanical treatment by deep rolling, and the successful modeling of the mechanical treatment and the process strategy.",
keywords = "Deep rolling, Distortion, Finite element method",
author = "Christian Schieber and Matthias Hettig and Zaeh, {Michael F.} and Carsten Heinzel",
note = "Publisher Copyright: {\textcopyright} 2022 The Author(s). Published by Trans Tech Publications Ltd, Switzerland.; 25th International Conference on Material Forming, ESAFORM 2022 ; Conference date: 27-04-2022 Through 29-04-2022",
year = "2022",
doi = "10.4028/p-kl033k",
language = "English",
isbn = "9783035717594",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications Ltd",
pages = "897--905",
editor = "Gabriela Vincze and Fr{\'e}d{\'e}ric Barlat",
booktitle = "Achievements and Trends in Material Forming- Peer-reviewed extended papers selected from the 25th International Conference on Material Forming, ESAFORM 2022",
}