Managing Technical Debt in Automation: Best Practices and Cross-Life-Cycle Strategies

Fandi Bi, Birgit Vogel-Heuser, Ziyi Huang, Kathrin Land, Felix Ocker

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

Abstract

Technical decisions that offer short-term gains but result in long-term disturbances and costs are often made due to the insufficient appreciation or underestimation of their scope, impact, and remedial actions. Technical Debt (TD) is a metaphor that embodies such phenomena and poses a particularly harmful threat when interdisciplinary teams interact and collaborate. The study presents new methods analyzing cross-company TD characteristics and positive TD best practice use cases gathered from 47 semi-structured expert interviews in the industrial automation domain. The three most important life cycle phases, the requirement, design, and testing phases, are addressed. The analysis demonstrates that, like adverse TD incidents, cross-life-cycle ripple effects can be advantageous or disadvantageous to the system. By implementing one measure, the system can benefit in multiple life-cycle phases and even disciplines. Additionally, the measures identified can prevent and eliminate numerous TD types and subtypes. The study elaborates on 31 measures that address 129 TD subtypes and proposes a systematic lessons-learned-based step for managing TD incidents in the automation sector.

OriginalspracheEnglisch
Titel2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023
Redakteure/-innenHelene Dorksen, Stefano Scanzio, Jurgen Jasperneite, Lukasz Wisniewski, Kim Fung Man, Thilo Sauter, Lucia Seno, Henning Trsek, Valeriy Vyatkin
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781665493130
DOIs
PublikationsstatusVeröffentlicht - 2023
Veranstaltung21st IEEE International Conference on Industrial Informatics, INDIN 2023 - Lemgo, Deutschland
Dauer: 17 Juli 202320 Juli 2023

Publikationsreihe

NameIEEE International Conference on Industrial Informatics (INDIN)
Band2023-July
ISSN (Print)1935-4576

Konferenz

Konferenz21st IEEE International Conference on Industrial Informatics, INDIN 2023
Land/GebietDeutschland
OrtLemgo
Zeitraum17/07/2320/07/23

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