Formalizing Selected Mechatronic Component's Constraints in SysML Models

Birgit Vogel-Heuser, Dominik Hujo, Marcus Volpert, Stefan Landler, Michael Otto, Karsten Stahl, Markus Zimmermann

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

Abstract

One of the limitations of classical SysML is that it does not provide information on how to model system component's constraints, which can result in individual model solutions for the same elements. To address this issue, we propose utilizing the reference mechanism in SysML to refer to REXS and ECLASS data standards, which can unambiguously define characteristic properties. Environmental factors such as temperature or humidity constraints play a vital role in designing components of mechatronic systems, like transmissions, or electrical and electronic components like sensors and actuators. Mechatronic component's properties may change depending on temperature and humidity and may show degradation. Such information is provided to some extent in the component's classified properties, like ECLASS and/or REXS, the engineering tool to configure gears. Such properties and constraints are further detailed in specification sheets provided by the manufacturer, e.g., by multi-dimensional manufacturer-specific parametric curves which are proposed to be explicitly included in the modeling process as SysML constraints. The proposed approach allows to include additional, not yet standardized environmental effects such as dirt layers in a formalized way. The formalized properties are modeled in parametric diagrams of SysML.

OriginalspracheEnglisch
TitelIECON 2023 - 49th Annual Conference of the IEEE Industrial Electronics Society
Herausgeber (Verlag)IEEE Computer Society
ISBN (elektronisch)9798350331820
DOIs
PublikationsstatusVeröffentlicht - 2023
Veranstaltung49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023 - Singapore, Singapur
Dauer: 16 Okt. 202319 Okt. 2023

Publikationsreihe

NameIECON Proceedings (Industrial Electronics Conference)
ISSN (Print)2162-4704
ISSN (elektronisch)2577-1647

Konferenz

Konferenz49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023
Land/GebietSingapur
OrtSingapore
Zeitraum16/10/2319/10/23

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