Flexible telepresent microassembly for varying batch sizes

Andrea Reiter; Michael F. Zaeh

Flexible telepresent microassembly for varying batch sizes

Lehrstuhl für Werkzeugmaschinen und Fertigungstechnik

Technische Universität München

Publikation: Konferenzbeitrag › Papier › Begutachtung

Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2007
Veranstaltung	Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007 - Paris, Frankreich Dauer: 27 März 2007 → 28 März 2007

Konferenz

Konferenz	Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007
Land/Gebiet	Frankreich
Ort	Paris
Zeitraum	27/03/07 → 28/03/07

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

Dieses zitieren

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title = "Flexible telepresent microassembly for varying batch sizes",

author = "Andrea Reiter and Zaeh, {Michael F.}",

year = "2007",

language = "English",

note = "Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007 ; Conference date: 27-03-2007 Through 28-03-2007",

}

TY - CONF

T1 - Flexible telepresent microassembly for varying batch sizes

AU - Reiter, Andrea

AU - Zaeh, Michael F.

PY - 2007

Y1 - 2007

UR - http://www.scopus.com/inward/record.url?scp=85064628288&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85064628288

T2 - Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007

Y2 - 27 March 2007 through 28 March 2007

ER -