TY - GEN
T1 - Entwicklung einer integrierten mikroelektromechanischen Pumpe für mobile Anwendungen
AU - Seidl, Martin
AU - Schrag, Gabriele
AU - Tumpold, David
N1 - Publisher Copyright:
© VDE VERLAG GMBH Berlin Offenbach
PY - 2019
Y1 - 2019
N2 - We present a micro-electro-mechanical pump for mobile applications, featuring up to one order of magnitude smaller surface area compared to state-of-the-art solutions. Chip edge lengths below 1,9 mm are accomplished using standardized MEMS manufacturing processes, enabling simple integration into mobile devices. Advanced finite element simulations are carried out in order to analyse the efficiency of the micropumps, as well as to identify the most auspicious design variants. Following these investigations, we developed a micropump concept with expected flow rates of 20 µl/min per mm3 device volume. On top of that, the compatibility to common, standardized semiconductor manufacturing techniques enables mass production with low production costs, and ensures consistent quality.
AB - We present a micro-electro-mechanical pump for mobile applications, featuring up to one order of magnitude smaller surface area compared to state-of-the-art solutions. Chip edge lengths below 1,9 mm are accomplished using standardized MEMS manufacturing processes, enabling simple integration into mobile devices. Advanced finite element simulations are carried out in order to analyse the efficiency of the micropumps, as well as to identify the most auspicious design variants. Following these investigations, we developed a micropump concept with expected flow rates of 20 µl/min per mm3 device volume. On top of that, the compatibility to common, standardized semiconductor manufacturing techniques enables mass production with low production costs, and ensures consistent quality.
UR - http://www.scopus.com/inward/record.url?scp=85096752368&partnerID=8YFLogxK
M3 - Konferenzbeitrag
AN - SCOPUS:85096752368
T3 - MikroSystemTechnik Kongress 2019 - Mikroelektronik MEMS-MOEMS Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
SP - 498
EP - 501
BT - MikroSystemTechnik Kongress 2019 - Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
PB - VDE VERLAG GMBH
T2 - MikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Artificial Intelligence
Y2 - 28 October 2019 through 30 October 2019
ER -