TY - GEN
T1 - Enabling technologies for system-level simulation of MEMS
AU - Bechtold, Tamara
AU - Schrag, Gabriele
AU - Feng, Lihong
PY - 2013
Y1 - 2013
N2 - The rapid progress in microelectromechanical systems (MEMS) and the evolution from a limited set of well-established applications, examples, in automotive industry, print heads, and digital light projection, to other fields mainly driven by consumer applications (such as image stabilization, smart phones, game consoles, etc.) opens a new market for these devices. It simultaneously creates the need for fast, efficient, and adequate design and optimization tools not only for stand-alone devices, but also for entire multiphysics microsystems comprising the MEMS component, the attached control and read-out circuitry and the package, while additionally considering environmental impacts potentially affecting the system functionality. This paper provides an overview of system-level modelling methodologies and tools.
AB - The rapid progress in microelectromechanical systems (MEMS) and the evolution from a limited set of well-established applications, examples, in automotive industry, print heads, and digital light projection, to other fields mainly driven by consumer applications (such as image stabilization, smart phones, game consoles, etc.) opens a new market for these devices. It simultaneously creates the need for fast, efficient, and adequate design and optimization tools not only for stand-alone devices, but also for entire multiphysics microsystems comprising the MEMS component, the attached control and read-out circuitry and the package, while additionally considering environmental impacts potentially affecting the system functionality. This paper provides an overview of system-level modelling methodologies and tools.
UR - https://www.scopus.com/pages/publications/84881005282
U2 - 10.1109/EuroSimE.2013.6529994
DO - 10.1109/EuroSimE.2013.6529994
M3 - Conference contribution
AN - SCOPUS:84881005282
SN - 9781467361385
T3 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Y2 - 14 April 2013 through 17 April 2013
ER -