Abstract
The most frequent failure of electronic components is electrochemical migration. As a consequence of the formation of humid films on contaminated printed circuit boards short cuts occur. To obtain an enhanced capacity the conductor spacings are reduced, promoting the danger of a fall out by short cuts. In this paper the main mechanisms of the electrochemical migration consisting of different reactions as metal solution, metal migration and metal deposition will be described in detail. Also methods to avoid electrochemical migration will be discussed.
| Titel in Übersetzung | Electromigration - a typical corrosion phenomenon in microelectronics |
|---|---|
| Originalsprache | Deutsch |
| Seiten (von - bis) | 366-369 |
| Seitenumfang | 4 |
| Fachzeitschrift | Materials and Corrosion |
| Jahrgang | 46 |
| Ausgabenummer | 6 |
| Publikationsstatus | Veröffentlicht - Juni 1995 |