Development of a new 3D OpenFOAM® solver to model the cooling stage in profile extrusion

C. Fernandes, F. Habla, O. S. Carneiro, O. Hinrichsen, J. M. Nóbrega

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

1 Zitat (Scopus)

Abstract

In this work a new solver is developed in OpenFOAM® computational library, to model the cooling state in profile extrusion. The solver is able to calculate the temperature distribution in a two domain system, comprising the profile and calibrator, considering the temperature discontinuity at the interface. The derivation of the model is based on the local instantaneous energy conservation equation, in conjunction with the conditional volume averaging technique, which yields a single governing equation valid in both domains. Aiming the solution of automatic optimization/parameterization problems, the developed solver was coupled with the DAKOTA toolkit. The application of the novel calculation system is illustrated in a study of a complex geometry extruded profile cooling stage.

OriginalspracheEnglisch
TitelProceedings of PPS 2015
UntertitelThe 31st International Conference of the Polymer Processing Society - Conference Papers
Redakteure/-innenByungohk Rhee
Herausgeber (Verlag)American Institute of Physics Inc.
ISBN (elektronisch)9780735413603
DOIs
PublikationsstatusVeröffentlicht - 9 März 2016
Veranstaltung31st International Conference of the Polymer Processing Society, PPS 2015 - Jeju Island, Südkorea
Dauer: 7 Juni 201511 Juni 2015

Publikationsreihe

NameAIP Conference Proceedings
Band1713
ISSN (Print)0094-243X
ISSN (elektronisch)1551-7616

Konferenz

Konferenz31st International Conference of the Polymer Processing Society, PPS 2015
Land/GebietSüdkorea
OrtJeju Island
Zeitraum7/06/1511/06/15

Fingerprint

Untersuchen Sie die Forschungsthemen von „Development of a new 3D OpenFOAM® solver to model the cooling stage in profile extrusion“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren