Design of a Micropump Based on an Industrial Microphone Manufacturing Process

Martin Seidl, Gabriele Schrag, Wolfgang Klein, Matthias Vobl, Ulrich Krumbein

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

1 Zitat (Scopus)

Abstract

We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm3 device volume.

OriginalspracheEnglisch
Titel2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781728132860
DOIs
PublikationsstatusVeröffentlicht - Mai 2019
Veranstaltung2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, Frankreich
Dauer: 12 Mai 201915 Mai 2019

Publikationsreihe

Name2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Konferenz

Konferenz2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
Land/GebietFrankreich
OrtParis
Zeitraum12/05/1915/05/19

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