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Comparative study of contact topographies of 4.5kV SiC MPS diodes for optimizing the forward characteristics

  • Technische Universität München

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

8 Zitate (Scopus)

Abstract

The forward characteristics of MPS diodes is composed of two branches: the first one is determined by unipolar conductivity originating from the Schottky contact, while the second one arises from hole injection by the Ohmic contact. A high ratio Ws/Wo of the Schottky contact area Ws to the Ohmic contact area Wo results in high unipolar conductivity and, thus, less heat dissipation under normal operation condition. But the bipolar injection efficiency is too law to support a high surge current capability. We attempt to give some guidelines how these two complementary functional principles can be combined with a view to finding optimum trade-offs for given customer-defined specifications, such as blocking voltage, nominal forward current, and surge current capability. In this work, several novel contact topographies are investigated using comprehensive 2D and 3D computer simulation to analyze consecutive improvements of the trade-off between regular (nominal) operation and surge mode, These TCAD simulations provide a physical understanding of the inner electronic device behavior of each topography considered and lead us eventually to novel concepts.

OriginalspracheEnglisch
Titel2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016
Redakteure/-innenPeter Pichler, Eberhard Bar, Jurgen Lorenz
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten117-120
Seitenumfang4
ISBN (elektronisch)9781509008179
DOIs
PublikationsstatusVeröffentlicht - 20 Okt. 2016
Veranstaltung2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016 - Nuremberg, Deutschland
Dauer: 6 Sept. 20168 Sept. 2016

Publikationsreihe

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Konferenz

Konferenz2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016
Land/GebietDeutschland
OrtNuremberg
Zeitraum6/09/168/09/16

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