An investigation of haptic feedback effects in telepresent microassembly

Gunther Reinhart, Andrea Reiter

Publikation: Beitrag in FachzeitschriftArtikelBegutachtung

7 Zitate (Scopus)

Abstract

New manufacturing techniques are being continuously developed to facilitate producing micro parts and products. However, the assembly of these parts becomes very demanding when it comes to manual assembly, e. g. the assembly of prototypes or small batch sizes. The implementation of telepresence technology for such a task segment is a promising solution. This paper discusses the influences of haptic feedback for telepresent micro assembly. Furthermore, an experiment for haptic learning is described.

OriginalspracheEnglisch
Seiten (von - bis)581-586
Seitenumfang6
FachzeitschriftProduction Engineering
Jahrgang5
Ausgabenummer5
DOIs
PublikationsstatusVeröffentlicht - Okt. 2011

Fingerprint

Untersuchen Sie die Forschungsthemen von „An investigation of haptic feedback effects in telepresent microassembly“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren