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Wolfgang Ecker

Prof. Dr.-Ing.

1992 …2024

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  • 2024

    A Comparative Analysis of ARM and RISC-V ISAs for Deeply Embedded Systems

    Simson, N., Tahiraga, A. & Ecker, W., 2024, MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop. VDE VERLAG GMBH, S. 110-119 10 S. (MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • A Model-Driven Architecture Approach to Accelerate Software Code Generation

    Bhadra, M., Lopera, D. S., Kunzelmann, R. & Ecker, W., 2024, Proceedings - 2024 7th International Conference on Software and System Engineering, ICoSSE 2024. Institute of Electrical and Electronics Engineers Inc., S. 23-30 8 S. (Proceedings - 2024 7th International Conference on Software and System Engineering, ICoSSE 2024).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • A Model-Driven Architecture Approach to Efficient and Adaptable Software Code Generation

    Bhadra, M., Albert, D., Yun, U., Kunzelmann, R., Lopera, D. S. & Ecker, W., 2024, MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop. VDE VERLAG GMBH, S. 196-203 8 S. (MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • An Automated Exhaustive Fault Analysis Technique guided by Processor Formal Verification Methods

    Kaja, E., Gerlin, N., Zhao, B., Lopera, D. S., Halabi, J. A., Khan, A. S., Prebeck, S., Stoffel, D., Kunz, W. & Ecker, W., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • A Scalable RISC-V Hardware Platform for Intelligent Sensor Processing

    Bernardo, P. P., Schmid, P., Bringmann, O., Iftekhar, M., Sadiye, B., Mueller, W., Koch, A., Jentzsch, E., Sauer, A., Feldner, I. & Ecker, W., 2024, 2024 Design, Automation and Test in Europe Conference and Exhibition, DATE 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings -Design, Automation and Test in Europe, DATE).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • A Universal Specification Methodology for Quality Ensured, Highly Automated Generation of Design Models

    Kunzelmann, R., Baerens, E., Gerl, D., Bhadra, M., Schwarz, N. & Ecker, W., 2024, MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop. VDE VERLAG GMBH, S. 90-98 9 S. (MBMV 2024: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 27. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • Fake Timer: An Engine for Accurate Timing Estimation in Register Transfer Level Designs

    Lopera, D. S., Kunzelmann, R. N., Kaja, E. & Ecker, W., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Leveraging Large Language Models for the Automated Documentation of Hardware Designs

    Fernando, S., Kunzelmann, R., Lopera, D. S., Al Halabi, J. & Ecker, W., 2024, 2024 13th Mediterranean Conference on Embedded Computing, MECO 2024. Institute of Electrical and Electronics Engineers Inc., (2024 13th Mediterranean Conference on Embedded Computing, MECO 2024).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • PaGoRi:A Scalable Parallel Golomb-Rice Decoder

    Vaddeboina, M., Kaja, E., Yilmazer, A., Ghosh, U. & Ecker, W., 2024, Proceedings - 2024 27th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2024. Deniziak, S., Sitek, P., Jenihhin, M., Steininger, A., Scholzel, M. & Mrazek, V. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 67-72 6 S. (Proceedings - 2024 27th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2024).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • 2023

    Bits, Flips and RISCs

    Gerlin, N., Kaja, E., Vargas, F., Lu, L., Breitenreiter, A., Chen, J., Ulbricht, M., Gomez, M., Tahiraga, A., Prebeck, S., Jentzsch, E., Krstic, M. & Ecker, W., 2023, Proceedings - 2023 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2023. Jenihhin, M., Kubatova, H., Metens, N., Metens, N., Raik, J., Ahmed, F. & Belohoubek, J. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 140-149 10 S. (Proceedings - 2023 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2023).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Effective Processor Model Generation from Instruction Set Simulator to Hardware Design

    Kappes, J., Kunzelmann, R., Emrich, K., Foik, C., Mueller-Gritschneder, D. & Ecker, W., 2023, 2023 IEEE Nordic Circuits and Systems Conference, NorCAS 2023 - Proceedings. Nurmi, J., Ellervee, P., Koch, P., Moradi, F. & Shen, M. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., (2023 IEEE Nordic Circuits and Systems Conference, NorCAS 2023 - Proceedings).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • FPGA-implementation techniques to efficiently test application readiness of mixed-signal products

    Rutsch, G., Maier, K. & Ecker, W., 2023, 2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration, VLSI-SoC 2023. IEEE Computer Society, (IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Generator IP-reuse and Automated Infrastructure Generation for Model-based Full-Chip Generation

    Schreiner, J., Gontia, V. R., Prebeck, S. & Ecker, W., 2023, MBMV 2023 - Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, 26. Workshop. VDE VERLAG GMBH, S. 25-36 12 S. (MBMV 2023 - Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, 26. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • G-QED: Generalized QED Pre-silicon Verification beyond Non-Interfering Hardware Accelerators

    Chattopadhyay, S., Devarajegowda, K., Zhao, B., Lonsing, F., D'Agostino, B. A., Vavelidou, I., Bhatt, V. D., Prebeck, S., Ecker, W., Trippel, C., Barrett, C. & Mitra, S., 2023, 2023 60th ACM/IEEE Design Automation Conference, DAC 2023. Institute of Electrical and Electronics Engineers Inc., (Proceedings - Design Automation Conference; Band 2023-July).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Modelling Peripheral Designs using FSM-like Notation for Complete Property Set Generation

    Kaja, E., Gerlin, N., Kunzelmann, R., Devarajegowda, K. & Ecker, W., 2023, Proceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023. Institute of Electrical and Electronics Engineers Inc., S. 508-515 8 S. (Proceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Parallel Golomb-Rice Decoder with 8-bit Unary Decoding for Weight Compression in TinyML Applications

    Vaddeboina, M., Kaja, E., Yilmayer, A., Prebeck, S. & Ecker, W., 2023, Proceedings - 2023 26th Euromicro Conference on Digital System Design, DSD 2023. Niar, S., Ouarnoughi, H. & Skavhaug, A. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 227-234 8 S. (Proceedings - 2023 26th Euromicro Conference on Digital System Design, DSD 2023).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • Special Session: Machine Learning for Embedded System Design

    Alcorta, E. S., Gerstlauer, A., Deng, C., Sun, Q., Zhang, Z., Xu, C., Wills, L. W., Lopera, D. S., Ecker, W., Garg, S. & Hu, J., 2023, Proceedings - 2023 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023. Institute of Electrical and Electronics Engineers Inc., S. 28-37 10 S. (Proceedings - 2023 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    Open Access

  • Using Graph Neural Networks for Timing Estimations of RTL Intermediate Representations

    Sánchez Lopera, D., Subedi, I. & Ecker, W., 2023, 2023 ACM/IEEE 5th Workshop on Machine Learning for CAD, MLCAD 2023. Institute of Electrical and Electronics Engineers Inc., (2023 ACM/IEEE 5th Workshop on Machine Learning for CAD, MLCAD 2023).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)
  • 2022

    A framework that enables systematic analysis of mixed-signal applications on FPGA

    Rutsch, G., Groebner, M., Sanders, A., Maier, K. & Ecker, W., 2022, Proceedings of the 2022 33rd IEEE International Workshop on Rapid System Prototyping: Shortening the Path from Specification to Prototype, RSP 2022. IEEE Computer Society, S. 50-56 7 S. (Proceedings - IEEE International Symposium on Rapid System Prototyping, RSP; Band 2022-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • Applying GNNs to timing estimation at RTL

    Lopera, D. S. & Ecker, W., 30 Okt. 2022, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022. Institute of Electrical and Electronics Engineers Inc., 3. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    9 Zitate (Scopus)

  • A Scalable, Configurable and Programmable Vector Dot-Product Unit for Edge AI

    Prebeck, S., Ashok, S., Vaddeboina, M., Devarajegowda, K. & Ecker, W., 2022, MBMV 2022: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 25. Workshop. VDE VERLAG GMBH, S. 27-35 9 S. (MBMV 2022: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 25. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • A Smart HW-Accelerator for Non-uniform Linear Interpolation of ML-Activation Functions

    Prebeck, S., Lawand, W., Vaddeboina, M. & Ecker, W., 2022, Embedded Computer Systems: Architectures, Modeling, and Simulation - 22nd International Conference, SAMOS 2022, Proceedings. Orailoglu, A., Reichenbach, M. & Jung, M. (Hrsg.). Springer Science and Business Media Deutschland GmbH, S. 267-282 16 S. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 13511 LNCS).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Design of a Tightly-Coupled RISC-V Physical Memory Protection Unit for Online Error Detection

    Gerlin, N., Kaja, E., Bora, M., Devarajegowda, K., Stoffel, D., Kunz, W. & Ecker, W., 2022, Proceedings of the 2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration, VLSI-SoC 2022. IEEE Computer Society, (IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC; Band 2022-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • Fast and Accurate Model-Driven FPGA-based System-Level Fault Emulation

    Kaja, E., Gerlin, N., Bora, M., Rutsch, G., Devarajegowda, K., Stoffel, D., Kunz, W. & Ecker, W., 2022, Proceedings of the 2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration, VLSI-SoC 2022. IEEE Computer Society, (IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC; Band 2022-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • MetaFS: Model-driven Fault Simulation Framework

    Kaja, E., Gerlin, N., Bora, M., Devarajegowda, K., Stoffel, D., Kunz, W. & Ecker, W., 2022, Proceedings - 35th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2022. Cassano, L., Chakravarty, S. & Bosio, A. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT; Band 2022-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • The Scale4Edge RISC-V Ecosystem

    Ecker, W., Adelt, P., Mueller, W., Heckmann, R., Krstic, M., Herdt, V., Drechsler, R., Angst, G., Wimmer, R., Mauderer, A., Stahl, R., Emrich, K., Mueller-Gritschneder, D., Becker, B., Scholl, P., Jentzsch, E., Schlamelcher, J., Gruttner, K., Bernardo, P. P. & Bringmann, O. &7 mehr, Damian, M., Oppermann, J., Koch, A., Bormann, J., Partzsch, J., Mayr, C. & Kunz, W., 2022, Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022. Bolchini, C., Verbauwhede, I. & Vatajelu, I. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 808-813 6 S. (Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    4 Zitate (Scopus)

  • Transformative Hardware Design Following the Model-Driven Architecture Vision

    Han, Z., Rutsch, G., Wang, D., Li, B., Prebeck, S. S., Lopera, D. S., Devarajegowda, K. & Ecker, W., 2022, VLSI-SoC: Technology Advancement on SoC Design - 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Revised and Extended Selected Papers. Grimblatt, V., Chang, C. H., Chattopadhyay, A., Reis, R. & Calimera, A. (Hrsg.). Springer Science and Business Media Deutschland GmbH, S. 49-70 22 S. (IFIP Advances in Information and Communication Technology; Band 661 IFIP).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • 2021

    Aspect-Oriented Design Automation with Model Transformation

    Han, Z., Wang, D., Rutsch, G., Li, B., Prebeck, S. S., Lopera, D. S., Devarajegowda, K. & Ecker, W., 2021, Proceedings of the 2021 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021. IEEE Computer Society, (IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC; Band 2021-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • A Survey of Graph Neural Networks for Electronic Design Automation

    Lopera, D. S., Servadei, L., Kiprit, G. N., Hazra, S., Wille, R. & Ecker, W., 30 Aug. 2021, 2021 ACM/IEEE 3rd Workshop on Machine Learning for CAD, MLCAD 2021. Institute of Electrical and Electronics Engineers Inc., (2021 ACM/IEEE 3rd Workshop on Machine Learning for CAD, MLCAD 2021).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    45 Zitate (Scopus)

  • Automated HW/SW co-design for edge AI: State, challenges and steps ahead

    Bringmann, O., Ecker, W., Feldner, I., Frischknecht, A., Gerum, C., Hämäläinen, T., Hanif, M. A., Klaiber, M. J., Mueller-Gritschneder, D., Bernardo, P. P., Prebeck, S. & Shafique, M., 30 Sept. 2021, Proceedings - 2021 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2021. Association for Computing Machinery, Inc, S. 11-20 10 S. (Proceedings - 2021 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2021).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    Open Access
    16 Zitate (Scopus)

  • Extending verilator to enable fault simulation

    Kaja, E., Leon, N. O., Werner, M., Andrei-Tabacaru, B., Devarajegowda, K. & Ecker, W., 2021, MBMV 2021: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 24. Workshop. VDE VERLAG GMBH, S. 114-119 6 S. (MBMV 2021: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 24. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • ISA Modeling with Trace Notation for Context Free Property Generation

    Devarajegowda, K., Kaja, E., Prebeck, S. & Ecker, W., 5 Dez. 2021, 2021 58th ACM/IEEE Design Automation Conference, DAC 2021. Institute of Electrical and Electronics Engineers Inc., S. 619-624 6 S. (Proceedings - Design Automation Conference; Band 2021-December).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    3 Zitate (Scopus)

  • On self-verifying DSL generation for embedded systems automation

    Han, Z., Qazi, S., Werner, M., Devarajegowda, K. & Ecker, W., 2021, MBMV 2021: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 24. Workshop. VDE VERLAG GMBH, S. 124-130 7 S. (MBMV 2021: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen - 24. Workshop).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • RTL Delay Prediction Using Neural Networks

    Lopera, D. S., Servadei, L., Kasi, V. P., Prebeck, S. & Ecker, W., 2021, 2021 IEEE Nordic Circuits and Systems Conference, NORCAS 2021 - Proceedings. Nurmi, J., Wisland, D. T., Aunet, S. & Kjelgaard, K. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., (2021 IEEE Nordic Circuits and Systems Conference, NORCAS 2021 - Proceedings).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    13 Zitate (Scopus)

  • Towards Fault Simulation at Mixed Register-Transfer/Gate-Level Models

    Kaja, E., Gerlin, N., Vaddeboina, M., Rivas, L., Prebeck, S., Han, Z., Devarajegowda, K. & Ecker, W., 2021, 34th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2021. Dilillo, L., Cassano, L. & Papadimitriou, A. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., (Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT; Band 2021-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    6 Zitate (Scopus)
  • 2020

    Automated SoC Hardening with Model Transformation

    Bavache, V. B., Han, Z., Hartlieb, H., Kaja, E., Devarajegowda, K. & Ecker, W., 6 Okt. 2020, 17th Biennial Baltic Electronics Conference, BEC 2020. IEEE Computer Society, 9276994. (Proceedings of the Biennial Baltic Electronics Conference, BEC; Band 2020-October).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    3 Zitate (Scopus)

  • Automatic compiler optimization on embedded software through k-means clustering

    Werner, M., Servadei, L., Wille, R. & Ecker, W., 16 Nov. 2020, MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD. Association for Computing Machinery, Inc, S. 157-162 6 S. (MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    1 Zitat (Scopus)

  • Cost estimation for configurable model-driven SoC designs using machine learning

    Servadei, L., Mosca, E., Devarajegowda, K., Werner, M., Ecker, W. & Wille, R., 7 Sept. 2020, GLSVLSI 2020 - Proceedings of the 2020 Great Lakes Symposium on VLSI. Association for Computing Machinery, S. 405-410 6 S. (Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Cost optimization at early stages of design using deep reinforcement learning

    Servadei, L., Zheng, J., Arjona-Medina, J., Werner, M., Esen, V., Hochreiter, S., Ecker, W. & Wille, R., 16 Nov. 2020, MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD. Association for Computing Machinery, Inc, S. 37-42 6 S. (MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Gap-free Processor Verification by S2QED and Property Generation

    Devarajegowda, K., Fadiheh, M. R., Singh, E., Barrett, C., Mitra, S., Ecker, W., Stoffel, D. & Kunz, W., März 2020, Proceedings of the 2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020. Di Natale, G., Bolchini, C. & Vatajelu, E.-I. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 526-531 6 S. 9116515. (Proceedings of the 2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020).

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    13 Zitate (Scopus)

  • Kamel: IP-XACT compatible intermediate meta-model for IP generation

    Rautakoura, A., Kayra, M., Hamalainen, T. D., Ecker, W., Pekkarinen, E. & Teuho, M., Aug. 2020, Proceedings - Euromicro Conference on Digital System Design, DSD 2020. Trost, A., Zemva, A. & Skavhaug, A. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 325-331 7 S. 9217651. (Proceedings - Euromicro Conference on Digital System Design, DSD 2020).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    4 Zitate (Scopus)

  • Optimized HW/FW Generation from an Abstract Register Interface Model

    Werner, M., Zeraliu, I., Han, Z., Prebeck, S., Servardei, L. & Ecker, W., Aug. 2020, Proceedings - Euromicro Conference on Digital System Design, DSD 2020. Trost, A., Zemva, A. & Skavhaug, A. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 35-39 5 S. 9217633. (Proceedings - Euromicro Conference on Digital System Design, DSD 2020).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    2 Zitate (Scopus)

  • SOC design automation with ML - It's time for research

    Bhatt, V. D., Ecker, W., Esen, V., Han, Z., Lopera, D. S., Patel, R., Servadei, L., Singla, S., Wenzek, S., Yadav, V. & Zennaro, E., 16 Nov. 2020, MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD. Association for Computing Machinery, Inc, S. 35-36 2 S. (MLCAD 2020 - Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • 2019

    Accurate Cost Estimation of Memory Systems Inspired by Machine Learning for Computer Vision

    Servadei, L., Zennaro, E., Devarajegowda, K., Manzinger, M., Ecker, W. & Wille, R., 14 Mai 2019, Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019. Institute of Electrical and Electronics Engineers Inc., S. 1277-1280 4 S. 8714961. (Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

    7 Zitate (Scopus)

  • Combining evolutionary algorithms and deep learning for hardware/software interface optimization

    Servadei, L., Mosca, E., Werner, M., Esen, V., Wille, R. & Ecker, W., Sept. 2019, 2019 ACM/IEEE 1st Workshop on Machine Learning for CAD, MLCAD 2019. Institute of Electrical and Electronics Engineers Inc., 9142090. (2019 ACM/IEEE 1st Workshop on Machine Learning for CAD, MLCAD 2019).

    Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

  • Embedded Systems' Automation following OMG's Model Driven Architecture Vision

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    7 Zitate (Scopus)

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    6 Zitate (Scopus)

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    Open Access
    10 Zitate (Scopus)